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Armstrong World Industries Partners with Integrated Environmental Solutions to Accelerate Validation and Adoption of Energy Saving Ceilings

Collaboration will introduce Armstrong® Templok® Ceilings to leading energy-modeling software designed to help architects, consultants, and engineers optimize building performance

LANCASTER, Pa. — Armstrong® World Industries and Integrated Environmental Solutions (IES) are collaborating to bring Armstrong® Templok® Energy Saving Ceilings into IES Virtual Environment (IESVE) software, a suite of integrated analysis tools used by engineers and architects around the world to optimize whole-building performance. Templok innovative ceiling panels use Phase Change Material (PCM) technology to passively regulate room temperature and can reduce a facility’s energy costs and consumption by as much as 15%.* The companies are working to include Templok—available in the Americas—in the IESVE Parametric Simulation feature used by sustainability and design experts to analyze a range of performance metrics including the prediction of carbon emissions, energy consumption, costs, thermal and visual comfort, and water usage.

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